SK hynix has begun purchasing TC bonder equipment for high-bandwidth memory (HBM) from Hanwha Semitech. This signifies a diversification of suppliers for TC bonders, which had been concentrated on HANMI Semiconductor. Industry insiders expect that SK hynix will increase its order volume for TC bonders from Hanwha Semitech in the future.
On the 14th, Hanwha Vision announced that its subsidiary Hanwha Semitech has signed a supply contract for semiconductor equipment worth 21 billion won with SK hynix. The equipment to be supplied by Hanwha Semitech is the TC bonder, a core piece of equipment for HBM manufacturing, which the company has been collaborating on technology development with SK hynix since last year.
The industry anticipates that this contract will strengthen the partnership between SK hynix, which has risen to the core of SK Group, and the semiconductor equipment industry, a new growth driver for Hanwha Group. Notably, Hanwha Semitech's semiconductor equipment business is led by Kim Dong-sun, the second son of Hanwha Group Chairman Kim Seung-yeon, indicating support from the group level.
From SK hynix's perspective, diversifying TC bonder suppliers has created advantageous conditions for increasing HBM production capacity and reducing expenses. SK hynix maintains partnerships with HANMI Semiconductor, Hanwha Semitech, and ASMPT from Singapore, leading the HBM equipment ecosystem.