Hanmi Semiconductor announced on the 6th that it held the groundbreaking ceremony for its seventh factory of the key equipment 'TC Bonder' for high-bandwidth memory (HBM) manufacturing in Seo-gu, Incheon.
The factory is a two-story building with a total floor area of 14,400 square meters (approximately 4,356 pyeong) and is scheduled for completion in the fourth quarter of 2025. It will be used as a TC Bonder manufacturing facility to produce high-spec HBM of 12 layers or more HBM3E, which will be supplied to NVIDIA and Broadcom.
Hanmi Semiconductor is the world's number one company in the TC Bonder segment for HBM production.
Once this factory is completed, Hanmi Semiconductor will secure a total HBM TC Bonder production line of 89,530 square meters (approximately 27,083 pyeong). This is a level capable of producing up to 2 trillion won in revenue.
Chairman Kwak Dong-shin of Hanmi Semiconductor said, 'With the rapid growth of the AI market, the global HBM market is exploding annually,' and noted, 'Hanmi Semiconductor has started construction of an additional TC Bonder factory to have production capacity ahead of the demand in the HBM market.' Chairman Kwak added, 'We will do our utmost to achieve our sales target of 1.2 trillion won in 2025 and 2 trillion won in 2026.'