Semiconductor equipment company Hanmi Semiconductor announced on the 16th that Vice Chairman Kwak Dong-shin, 50, has been promoted to chairman after 17 years.
Chairman Kwak, who joined Hanmi Semiconductor in 1998 and has worked there for 26 years, is recognized for his contributions in successfully developing the essential process equipment for artificial intelligence (AI) semiconductors, the high-bandwidth memory (HBM) TC Bonder, growing the company into a leading semiconductor equipment corporations in South Korea, with a market capitalization exceeding 8 trillion won.
Chairman Kwak noted, "With the rapid growth of the AI market, the global HBM market is explosively increasing every year, and the next-generation product Blackwell from NVIDIA, a leader in AI semiconductors, is also being produced with Hanmi Semiconductor's TC Bonder," adding, "The status and competitiveness of Hanmi Semiconductor, which holds the world market share of HBM TC Bonder, remains unchanged."
On the same day, Chairman Kwak unveiled a new piece of equipment for next-generation HBM production, the TC Bonder Griffin Super Bonder Head (TC BONDER GRIFFIN SB 1.0). He expressed confidence that "the new bonding head features improved productivity and precision in stacking semiconductor chips" and stated, "It will significantly contribute to next year's sales."