Hanwha Semitronics, which has emerged as a rival to HANMI Semiconductor, is said to be negotiating the supply of TC bonders (thermal compression bonding equipment), the key equipment for the manufacturing of HBM3E (5th Generation HBM) 16-layer, with SK hynix. After successfully supplying TC bonders for HBM3E 8-layer and 12-layer manufacturing five years after starting development, Hanwha Semitronics is expected to establish a strong position in the semiconductor equipment sector if it passes the quality tests from SK hynix for the highest-layer TC bonders.
According to industry sources on the 28th, the TC bonder products that Hanwha Semitronics will supply to SK hynix this year are expected to be used for HBM3E manufacturing from 8 layers up to a maximum of 16 layers. Currently, the highest-layer product of HBM3E is 12-layer, which SK hynix is supplying to NVIDIA. The 16-layer product that SK hynix is ambitiously preparing was tested with Singapore's ASMPT equipment during the prototype phase, but Hanwha Semitronics' equipment is also expected to be used in mass production.
The TC bonder is a key piece of equipment necessary for manufacturing HBM for artificial intelligence (AI) semiconductors. HBM is made by stacking multiple DRAMs, and the TC bonder is used in the process of applying heat and pressure to fix the DRAMs. Until now, SK hynix has primarily utilized HANMI Semiconductor equipment, but has been actively pursuing the introduction of equipment from Hanwha Semitronics and ASMPT for supply chain stabilization.
An insider familiar with SK hynix stated, "The equipment for which the supply contract with Hanwha Semitronics has been finalized is for HBM3E 8-layer and 12-layer, but discussions have been held to potentially adapt it for 16-layer products through improvements," and explained, "The TC bonder demonstrated greater-than-expected productivity and stability during the quality testing process, so it will play a role in diversifying the TC bonder options that SK hynix has pursued."
Earlier, Hanwha Semitronics announced on the 27th that it had signed a supply contract for HBM TC bonders worth 21 billion won with SK hynix. Previously, on the 14th, it also entered into a supply contract for HBM TC bonders worth 21 billion won with SK hynix. The cumulative contract amount for the TC bonders supplied to SK hynix has now exceeded 40 billion won.
According to the market research firm TrendForce, the global high-bandwidth memory (HBM) market size is expected to grow by 156% from last year's $18.2 billion (approximately 26.4 trillion won) to $46.7 billion (67.9 trillion won) next year.
Previously, Hanwha Semitronics began developing TC bonders in 2020, and is reported to have started quality testing in earnest last year, succeeding earlier this year. On the 10th of last month, it changed its name from Hanwha Precision Machinery to Hanwha Semitronics, reflecting its commitment to becoming a "comprehensive semiconductor manufacturing solution company." Along with this, Kim Dong-seon, the third son of Hanwha Group Chairman Kim Seung-yeon, joined as head of future vision.
Last month, during the Semicon Korea 2025, the largest semiconductor fair in the country which Hanwha Semitronics participated in for the first time, Vice President Kim noted, "The key to market competitiveness is only innovative technology," and said, "We will continue to expand our investment in research and development to develop differentiated technologies."