Naieel (Nano Advanterure in Energy Environmental Laeding) Technology, a researcher-founded corporations from the Korea Atomic Energy Research Institute (KAERI) and a research institute corporations under Korea Science and Technology Holdings, said on the 17th that it had secured a strategic investment from Denka, a leading Japanese materials company.
Naieel Technology is a startup with synthesis and production technology for boron nitride nanotubes (BNNT), and it is the first in the world to secure mass production technology for BNNT at an industrially usable, ton-scale level.
BNNTs are nanotubes made using nitrogen and boron instead of carbon, with excellent thermal conductivity, strength, elasticity, thermal and chemical stability, and space radiation shielding performance, while also being safe for the human body. Because of this, they can be used in a wide range of fields, including semiconductors, electronic components, energy, aerospace, and bio.
The Korea Atomic Energy Research Institute (KAERI) said this investment signifies that Tomorrow Technology's unrivaled production technology has been officially recognized in the global market.
Along with the investment, Denka plans to jointly pursue the development of next-generation thermal management materials, including BNNT-based thermal fillers.
Thermally conductive ceramic filler materials using BNNT can improve the thermal conductivity of semiconductor packaging materials by at least 20% over existing levels and by more than 50% depending on the design. Based on this, the two sides plan to develop AI semiconductor packaging materials such as next-generation epoxy molding compounds (EMC), non-conductive films (NCF), and thermal interface materials (TIM).
Kim Jae-woo, CEO of Naieel Technology, said, "It is highly meaningful that the original BNNT technology developed domestically has been recognized for productivity and quality by a major Japanese materials powerhouse," and added, "Through strategic cooperation with Denka, we will grow into a global leader in next-generation AI semiconductor packaging materials."