The Korean Agency for Technology and Standards of the Ministry of Trade, Industry and Energy (Administrator Kim Dae-ja) said on the 26th that it held the 2025 semiconductor standardization forum.
About 90 domestic semiconductor experts, including from Samsung Electronics and SK hynix, attended the forum. Experts from the IEC Semiconductor Devices Technical Committee, the International Semiconductor Equipment and Materials Association (SEMI), and the JEDEC Solid State Technology Association (JEDEC), the world's three leading semiconductor standardization bodies, also took part.
At the forum, the agency introduced two new international standard proposals that Korea proposed at the IEC meeting held in Japan last week. One is a method for evaluating hybrid bonding strength that directly bonds wafers without intermediate structures (bumps). A method for evaluating the precision of power semiconductor wafer dicing (cutting) was also introduced.
These two standards are criteria for objectively evaluating the reliability of wafer bonding and chip (die) separation processes. An official at the agency said, "We expect this will help domestic semiconductor packaging and process equipment corporations reduce the burden of aligning specifications with global clients and of duplicative testing."
Kim Dae-ja, head of the national standards agency, said, "Under the World Trade Organization (WTO) system, public international standards such as those of the IEC have functioned as a common language of trade, but recently the influence of de facto global standards such as those of SEMI and JEDEC has expanded," adding, "We will support domestic corporations so they can take a leading role in these global standardization bodies."