Samsung Electro-Mechanics will unveil next-generation semiconductor substrate technologies, including 2.5D and 2.1D package substrates and glass substrates used in artificial intelligence (AI) accelerators and servers.
Samsung Electro-Mechanics will take part in KPCA Show 2026 (International Semiconductor Substrate and Advanced Packaging Industry Exhibition), which opens on the 9th at Songdo Convensia in Incheon. The exhibition runs through the 11th.
A semiconductor package substrate is a component that connects a semiconductor chip and the mainboard to deliver electrical signals and power. As the performance of AI accelerators and server central processing units (CPU) improves and the approach of placing multiple high-performance chips in a single package spreads, the importance of large-area, high-layer-count substrates, fine circuits, and high-density connection technology is growing.
At this exhibition, Samsung Electro-Mechanics will showcase five items: a 2.5D package substrate, a 2.1D package substrate, a glass substrate, an automotive flip-chip ball grid array (FCBGA), and an ultra-thin chip-scale package (UTCSP) substrate. The 2.5D package substrate is used to connect multiple semiconductor chips at high density. Samsung Electro-Mechanics will exhibit technologies that reduce substrate warpage that can occur during the transition to larger areas and higher layer counts, and that enable high-speed signal transmission and high-density connections.
The 2.1D package substrate connects semiconductor chips using fine-circuit and high-density connection technologies without a silicon interposer. Samsung Electro-Mechanics plans to use this to address high-speed, high-integration chip connections required for AI Semiconductor.
It will also unveil glass substrate technology, regarded as a next-generation package substrate. A glass substrate uses glass as the core material instead of conventional organic materials to reduce substrate warpage and improve dimensional stability. Samsung Electro-Mechanics will introduce technologies for forming fine connection vias in glass and filling them with metal, as well as surface precision processing technologies.
It will also exhibit substrates for data centers and mobile devices. The UTCSP substrate is a product that reduces substrate thickness by applying a coreless structure and fine bond finger technology. It will also showcase an ultra-thin core (UTC) package substrate used for laptop and tablet CPUs and a co-package substrate for smartphones.
In automotive package substrates, it will introduce reliability technologies that can withstand high temperature, high humidity, and repeated temperature changes, alongside large-area, high-layer-count and fine-circuit technologies. Samsung Electro-Mechanics will also exhibit high-function substrate technologies with multi-chip structures that can be applied to semiconductors for Autonomous Driving.
Ju Hyeok, head of the Package Solution Business Unit (executive vice president) at Samsung Electro-Mechanics, said, "As the high-performance semiconductor market, including AI accelerators, servers, and Autonomous Driving, grows, the role of package substrates and the level of technical difficulty are rising rapidly," and added, "We will advance large-area, high-layer-count, and ultra-fine circuit technologies and next-generation packaging technologies to address the high-end semiconductor package substrate market."