Goyoung Technology said on the 7th that it unveiled a three-dimensional (3D) precision measurement–based semiconductor inspection solution and wrapped up its exhibit after taking part in Semicon Taiwan 2026, held in Taiwan on the 2nd to 4th.
At this exhibition, the company led with its Meister series to introduce a transparent-object 3D inspection solution for advanced packaging and a micro-bump inspection solution for wafer-level packaging, and it also conducted live demonstrations of precision measurements using actual semiconductor components on-site.
The Meister series is inspection equipment that applies Goyoung's 3D precision measurement technology, built in the electronics manufacturing field, to semiconductor back-end processes, and it is used for process quality control by precisely measuring the height and shape of bumps and chips. Aided by growth in the artificial intelligence and high-performance computing markets, the company is also expanding its scope to the inspection of optical communication components.
A Goyoung official said, "As semiconductor packaging becomes more precise, the importance of inspection technologies such as 3D micro-bump measurement and transparent-object thickness measurement is growing," and added, "We plan to continue expanding our business into inspection areas related to AI infrastructure, including advanced packaging, optical communication components, and SOCAMM."