HANMI Semiconductor said on the 2nd that it will participate in the "2026 Semicon Taiwan" exhibition being held in Taipei, Taiwan, through the 4th, and showcase advanced packaging equipment including 2.5D thermocompression bonders (TC bonders) for artificial intelligence (AI) system semiconductors and TC bonders for high-bandwidth memory (HBM). HANMI Semiconductor has participated as an official Semicon Taiwan sponsor for 12 consecutive years from 2015 through this year.
HANMI Semiconductor holds the global No. 1 position in the TC bonder market for HBM, and recently has expanded into the AI system semiconductor 2.5D packaging field, solidifying its presence in the advanced packaging equipment market.
At this exhibition, five types of 2.5D packaging equipment will be unveiled: "FC Bonder 3.5," "FC Bonder 75," "2.5D TC Bonder 40 C2S," "2.5D TC Bonder 40 C2W," and "2.5D TC Bonder 120." Among them, "FC Bonder 3.5," "FC Bonder 75," and "2.5D TC Bonder 40 C2S·C2W" have been released sequentially since the end of last year and are being supplied for mass production to global foundries and outsourced semiconductor assembly and test (OSAT) corporations, while "2.5D TC Bonder 120" is set to launch.
2.5D packaging is an advanced packaging technology that integrates multiple chips such as a graphics processing unit (GPU), central processing unit (CPU), and HBM into a single package on a silicon interposer, and it has high utility in the AI Semiconductor field. TSMC's CoWoS is a representative 2.5D packaging technology that has become a core technology in AI semiconductors and high-performance computing (HPC), and global AI Semiconductor corporations such as Nvidia and AMD are actively adopting it.
Recently, demand for 2.5D packaging equipment has also been increasing in Intel's EMIB technology. In particular, EMIB-T technology drew attention as it is applied to Google's tensor processing unit (TPU), and as a high-performance packaging technology that combines through-silicon vias (TSVs) with conventional EMIB, applying TC bonder equipment is essential.
HANMI Semiconductor has built an equipment lineup that supports silicon interposers and substrates in various sizes up to 350 mm × 350 mm, tailored to customer needs as 2.5D packaging demand grows in the AI Semiconductor market. Customers can choose between a TC bonder or an FC bonder depending on semiconductor characteristics.
HANMI Semiconductor will also introduce the "TC Bonder 4," an HBM4 production tool, and the "Wide TC Bonder," a next-generation HBM production tool. As global memory corporations begin HBM4 mass production this year, supplies of the "TC Bonder 4" are increasing, and the "Wide TC Bonder" is scheduled for release next year. The Wide TC Bonder supports HBM production with expanded DRAM die sizes; as die area increases, the number of TSVs and input/output (I/O) can be reliably increased, enabling expansion of memory capacity and bandwidth compared with existing solutions.
A HANMI Semiconductor official said, "Semicon Taiwan is a global event where AI Semiconductor technology converges," adding, "We will lead the growth of the AI Semiconductor market by expanding the supply of advanced packaging equipment not only for the global No. 1 HBM TC bonder but also for the AI system semiconductor market."
Semicon Taiwan is Taiwan's largest semiconductor industry exhibition organized by the Semiconductor Equipment and Materials International (SEMI). This year's event is the largest ever, with 1,300 semiconductor technology corporations from around the world operating 4,300 booths, and more than 100,000 industry experts expected to attend.