SK hynix will hold a groundbreaking ceremony on the 27th local time for a semiconductor packaging fab under construction in West Lafayette, Indiana.
According to the industry on the 12th, SK hynix finalized the groundbreaking date and sent invitations to major customers and partners. Company leadership, including CEO Kwak Noh-jung, and big tech CEO-level figures are expected to attend. There is also talk that SK Group Chairman Chey Tae-won and Nvidia CEO Jensen Huang may attend together.
Chairman Chey recently said in a local media interview marking SK hynix's American depositary receipt (ADR) listing that if conditions such as power, water, workforce, and supply chain are met, the company could consider building a local memory production line. Earlier this year, SK hynix established an AI solutions subsidiary, AI Company, in the United States.
Earlier in the United States, Commerce Secretary Howard Lutnick publicly called on Samsung Electronics and SK hynix to expand local memory production.
SK hynix is investing $3.87 billion (about 5.5 trillion won) to build an advanced packaging production base on the West Lafayette site. It began placement work in the first half of this year, and after the groundbreaking ceremony it will move into frame construction, with plans to mass-produce AI memory products, including High Bandwidth Memory (HBM), from the second half of 2028. Under the CHIPS Act, the U.S. government decided to provide up to $450 million (about 640 billion won) in direct subsidies and a $500 million (about 710 billion won) loan.