Samsung Electro-Mechanics is moving in earnest into the glass substrate business, cited as a next-generation semiconductor packaging technology. It will establish a joint venture (JV) within the year with an affiliate of Japan's Sumitomo Chemical and is conducting engineering sample verification with global big tech customers.
At its second-quarter earnings conference call on the 30th, Samsung Electro-Mechanics said, "We are proceeding with development of the glass substrate business in stages," and added, "In early this month, we signed a definitive agreement to establish a joint venture with Dongwoo Fine-Chem, a subsidiary of Japan's Sumitomo Chemical, to produce glass core."
The company said it plans to hold 66.2% of the joint venture's equity and aims to complete the establishment of the corporation within the year.
Glass substrate development is also underway with customers.
Samsung Electro-Mechanics said, "We are jointly developing large-area, high-layer glass substrates with global big tech customers that are developing semiconductors for data centers," adding, "With some customers, we have entered the stage of supplying samples for engineering qualification."
The company plans to sequentially carry out the construction of production facilities, process stabilization, and quality verification.
Samsung Electro-Mechanics said, "We plan to promote the construction of production facilities, process stabilization, and quality control and verification in stages to build a full-scale mass production system starting in 2028," adding, "We will respond to customer demand in a timely manner and secure a leading position in the glass substrate market."