SK hynix said it is discussing next year's high bandwidth memory (HBM) supply volumes and prices with major customers. It also said the sharp rise in general DRAM prices is expected to have some impact on HBM price negotiations.
SK hynix said at its second-quarter earnings conference call on the 29th, "We are currently discussing HBM supply volumes and prices for 2027 with major customers, and talks are proceeding smoothly based on solid customer demand."
It added, "Given that general DRAM prices have risen sharply recently, this market environment could have some impact on HBM price negotiations," but also noted, "HBM prices are not determined solely by movements in general DRAM prices."
The company said it comprehensively reflects resources and technical complexity involved in production, and the value provided to customers when setting HBM prices. HBM requires more wafers than general DRAM and also involves leading-edge processes, through-silicon vias (TSV), and advanced packaging capacity. With each product generation, the performance and quality levels customers demand rise, and the development and qualification process becomes more complex.
SK hynix said, "We negotiate prices with each customer by comprehensively considering not only the price and supply-demand environment of general DRAM, but also the resources and opportunity costs involved in HBM production, technical complexity, and the value the product provides to customers."
It continued, "While securing appropriate profitability that corresponds to the differentiated value provided to customers, we are focused on leading the healthy and sustainable growth of the AI ecosystem," and added, "We will maintain solid profitability in the HBM business based on technology, cost competitiveness, stable mass-production capability, and trust with customers."