A view of the SK hynix headquarters in Icheon, Gyeonggi. /Courtesy of News1

SK hynix will move up the construction schedule of the P&T7 advanced packaging plant in Cheongju, North Chungcheong, to meet rising demand for memory used in artificial intelligence (AI).

SK hynix said in a filing that its board met on the 22nd and approved an investment of 709.31 billion won for P&T7 construction. The investment equals 5.88% of its equity capital. To prepare for increased output, the company pulled forward the cleanroom ramp-up, which enlarges construction spending, and reapproved the investment plan.

The total project cost for P&T7 remains unchanged from the roughly 1.9 trillion won previously released. However, as the company accelerates construction and production facility build-out, funds will be deployed earlier than initially planned.

P&T7, which broke ground on Apr. 4, is SK hynix's seventh packaging and test facility. It is being built on a site of about 230,000 square meters within the Cheongju Technopolis industrial complex, with roughly 150,000 square meters of cleanroom space. It handles back-end processes that assemble semiconductor chips into finished products and test their performance and quality.

Nearby, M15X, a next-generation DRAM production base, is under construction. SK hynix plans to link M15X's front-end production facilities with P&T7's back-end processes to improve logistics efficiency and develop Cheongju into an integrated production hub for AI memory such as HBM.

The company plans to complete the wafer test line first in Oct. 2027 and sequentially build the wafer-level packaging line by Feb. 2028.

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