HANMI Semiconductor said on the 30th it will launch a new tool, "2.5D TC Bonder 40," which supports the 2.5-dimensional (D) packaging process for AI semiconductors. The company plans to supply equipment to global foundries and outsourced semiconductor assembly and test (OSAT) corporations to step up its push into the AI system semiconductor packaging market.
HANMI Semiconductor followed last year's debut of the "FC Bonder 75" by launching the "FC Bonder 3.5" on the 26th of this month. With the addition of the "2.5D TC Bonder 40," it has broadened its lineup of 2.5D packaging tools for AI system semiconductors. The company plans to use this to meet a range of customer needs, including processes for ultra-large dies and multi-chip integration.
2.5D packaging is seeing greater use in AI semiconductors and high-performance computing (HPC). Global big tech corporations such as Nvidia, AMD, Broadcom, Marvell, and Apple are adopting related processes for their in-house AI chip production. Representative technologies include TSMC's CoWoS (Chip on Wafer on Substrate) and Intel's EMIB (Embedded Multi-die Interconnect Bridge).
Packaging technology is also expanding to CoPoS (Chip on Panel on Substrate) and 3D SoIC (System on Integrated Chips). According to global market research firm Yole Group, the advanced packaging market, including 2.5D and 3D, is projected to grow from $46.0 billion in 2024 to $79.4 billion in 2030. The compound annual growth rate is 9.5%.
The "2.5D TC Bonder 40" is specialized for the chip-on-wafer process of CoWoS. It can handle dies from ultra-small 3x3 mm to ultra-large 40x40 mm. It is tailored for AI Semiconductor die packaging processes that require high-precision bonding.
The new tool applies Auto Conversion technology, which allows continuous processing of various types of chips. It also introduces a Reel Feeder Loading process to improve equipment operation efficiency. The Fluxless Bonding function is offered as an option to reduce micro defects and enhance quality reliability.
HANMI Semiconductor plans to establish a local U.S. subsidiary, "HANMI USA," at the end of this year. The company said it aims to broaden its supply chain in the U.S. market—where AI big tech, foundries, back-end, and memory corporations are clustered—by collaborating with customers from the chip planning stage.
A HANMI Semiconductor official said, "Building on the technological prowess that secured the global No. 1 position for HBM TC bonders in the AI memory market, we plan to expand our overwhelming influence in the exploding 2.5D packaging market for system semiconductors," adding, "We will achieve continued sales growth by building a diverse portfolio of semiconductor equipment in step with market demand."