HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply the equipment to global foundries (contract chip manufacturers) and outsourced semiconductor assembly and test (OSAT) corporations.
The FC Bonder 3.5 is equipment used in the 2.5-dimensional (D) packaging process. 2.5D packaging is a technology that places and connects multiple chips such as a graphics processing unit (GPU), central processing unit (CPU), and high bandwidth memory (HBM) on a single substrate. It is regarded as a key process in AI Semiconductor and high-performance computing (HPC).
HANMI Semiconductor is expanding the technology it secured in the thermal compression bonder (TC bonder) market for HBM to system semiconductor packaging equipment. Following the launch of the "FC Bonder 75" last year, the company added this product to expand its lineup supporting ultra-large dies and multi-chip integration processes. A die refers to an individual semiconductor chip cut from a wafer.
The FC Bonder 3.5 applies a chip-to-wafer (C2W) bonding method and can handle large panels and substrates up to 340 mm in size. C2W is a method of directly bonding individual chips onto a wafer. HANMI Semiconductor said it improved productivity and precision to meet the latest process standards required by global AI Semiconductor corporations.
Recently, AI Semiconductor packaging has evolved into a panel level package (PLP) method. As a multi-die structure that ties together GPU, CPU, HBM, and more spreads to boost AI chip performance, 250 mm and 310 mm class substrates are becoming major standards. HANMI Semiconductor believes the FC Bonder 3.5 can meet this demand for large substrates.
The range of process support was also widened. Along with flip chip bonding, the equipment includes a face-up (non-flip) bonding function using a die attach film (DAF). This means customers can select a bonding method tailored to their packaging conditions.
HANMI Semiconductor plans to establish a local U.S. subsidiary, "HANMI USA," at the end of this year to strengthen sales and customer support. In the U.S. market, where global big tech and AI Semiconductor corporations are concentrated, the company aims to expand supplies not only of TC bonders for HBM but also of equipment for system semiconductors.
A HANMI Semiconductor official said, "Based on the bonding technology proven with TC bonders for HBM, we will deliver results in the 2.5D packaging market as well," adding, "We will continue to introduce advanced packaging solutions needed in the AI Semiconductor era."