Koh Young Technology said on the 9th that it has made a full-fledged entry into the inspection equipment market for SOCAMM2 (Small Outline Compression Attached Memory Module), a next-generation AI memory module. The company won its first order for related equipment from a major domestic memory maker and is accelerating diversification of its semiconductor inspection equipment business.
SOCAMM2 is a next-generation memory module being developed to meet the explosive computing demand of AI servers and data centers, and, with higher space and power efficiency than conventional server memory, it is emerging as a key component of next-generation AI infrastructure. As the AI server market grows rapidly, memory modules are trending toward higher density and higher performance, and demand for the accompanying high-precision inspection technology is also expanding.
Koh Young Technology has supplied inspection solutions for semiconductor back-end and advanced packaging processes based on its proprietary 3D measurement technology. This SOCAMM2 order is the company's first case of supplying inspection equipment for this product line, and it is seen as securing a strategic bridgehead to expand its existing technological capabilities into the next-generation memory space.
The company said, "In addition to SOCAMM2, demand for semiconductor inspection equipment related to optical modules is also visibly increasing," and added, "With a favorable business environment continuing on the back of growing AI server demand, we expect the growth trend to continue in the second quarter following the first quarter."