HANMI Semiconductor took part in Taiwan's Computex for the first time and showcased High Bandwidth Memory (HBM) production equipment and next-generation packaging equipment.
HANMI Semiconductor said on the 4th that it participated in "Computex 2026," held from the 2nd to the 5th at Taipei Nangang Exhibition Center and the Taiwan World Trade Center (TWTC) in Taiwan.
Computex is one of Asia's largest information and communications technology (ICT) exhibitions, and about 1,500 corporations took part this year. In particular, the event featured keynote speeches by Jensen Huang, CEO of Nvidia, and Lisa Su, CEO of AMD, as well as leaders from global AI Semiconductor corporations such as Intel and Marvell.
At this exhibition, HANMI Semiconductor unveiled the "TC Bonder 4" for High Bandwidth Memory (HBM)4 mass production, which begins in earnest this year, and the "Wide TC Bonder" for next-generation HBM production.
The "Wide TC Bonder" supports HBM production with enlarged DRAM die sizes. The company said that as the die area of HBM grows, the number of Through Silicon Via (TSV) and input/output (I/O) interfaces can be increased stably, enabling expansion of memory capacity and bandwidth compared with prior technology.
It also introduced the "2.5D TC Bonder 40" and "2.5D TC Bonder 120," 2.5D packaging equipment for artificial intelligence (AI) semiconductors. The equipment is used in processes that integrate GPUs, CPUs, and HBM on a silicon interposer into a single package.
Meanwhile, as part of its strategy to expand the global AI Semiconductor supply chain, HANMI Semiconductor is pushing to establish a local subsidiary, "HANMI USA," in San Jose, California, by the end of this year. The company plans to use this exhibition as a springboard to expand cooperation with global semiconductor corporations.
A HANMI Semiconductor official said, "In recent years, the Computex exhibition has become a venue for exchanging innovative technologies across the global hardware supply chain and infrastructure, from AI chipset design to packaging, physical AI, and finished goods," adding, "We will showcase HANMI Semiconductor's unrivaled TC Bonder and next-generation equipment at the heart of AI semiconductors to further cement our leadership in the global market."