Samsung Electronics and SK hynix moved to compete for leadership over high-bandwidth memory (HBM), which has emerged as a core component in the age of artificial intelligence (AI), at Computex 2026, Asia's largest IT and computing trade show, in Taipei, Taiwan. Samsung Electronics highlighted its technological competitiveness by unveiling next-generation HBM5 (eighth-generation HBM) and new thermal management technology, while SK hynix underscored its market dominance by emphasizing expanded production capacity and an edge in Nvidia's supply chain.
This year's Computex is also unusual in that Samsung Electronics and SK hynix stepped to the forefront. In the past, Computex was closer to a stage for Taiwan corporations such as Nvidia, TSMC, and Foxconn, and the two Korean memory chipmakers rarely held separate events. But as the AI Semiconductor market has grown rapidly and HBM has emerged as a key component in Nvidia's supply chain, the atmosphere has shifted dramatically.
On the 2nd, the two companies met with reporters side by side and unveiled their respective strategies. SK Group Chairman Chey Tae-won visited Taipei in person for a global media briefing, while Samsung Electronics countered by having Song Jai-hyuk, president and chief technology officer (CTO) of the DS division, unveil next-generation technology.
Market attention centered on Samsung Electronics' technological prowess. Song unveiled an HBM5 mock-up (physical model) for the first time on the Computex show floor. This was the first time Samsung Electronics revealed next-generation HBM5 to the outside world. Samsung Electronics plans to apply a base die built on its in-house foundry 2-nanometer process to HBM5. At the same time, it unveiled HPB (Heat Path Block), a new thermal management technology. As AI Semiconductor performance becomes more advanced, heat control is emerging as the top challenge, leading to the judgment that the battleground in the next-generation market lies not only in speed but also in thermal efficiency.
Song said, "In the AI era, competitiveness in total solutions that encompass not only standalone memory but also foundry, logic, and packaging is important," expressing technological confidence. Following its industry-first start of HBM4 mass production in Feb. and sample shipments of HBM4E (seventh-generation HBM) last month, Samsung Electronics preemptively presented its HBM5 roadmap at this event, signaling a potential shift in the next-generation market landscape.
SK hynix, by contrast, put the emphasis on cementing market dominance. In a briefing on the same day, Chairman Chey said, "We maintain our existing outlook that the memory shortage will continue through 2030," adding, "We plan to double wafer production capacity within the next five years." The assessment is that not only AI data centers but also the AI PC market, which Nvidia has recently emphasized, will become a new source of memory demand. Chey stressed, "More memory will be needed as AI spreads," and "We will continue to invest to expand production capacity."
It also showcased a solid honeymoon with Nvidia. Chey met Nvidia Chief Executive Officer Jensen Huang right after his keynote address the previous day and crossed paths again at the SK hynix booth that day. After looking around SK hynix's HBM4E wafers and "SOCAMM2," a next-generation AI Server Memory module for AI servers, Huang left his signature, signaling deep trust.
In the current HBM race, SK hynix, which seized the market first, is being chased by Samsung Electronics on technology. Since the HBM3 and HBM3E generations, SK hynix has virtually monopolized Nvidia's supply chain, securing overwhelming mass-production experience and a share advantage. Samsung Electronics, by contrast, is seeking a shift in the balance at the next-generation standard. Following this year's industry-first HBM4 mass production and HBM4E sample shipments, Samsung Electronics used Computex to roll out a raft of gap-widening technologies such as HBM5 and 2-nanometer base dies, laying the groundwork for a counterattack.
Nvidia CEO Jensen Huang's designation of both companies as HBM4 suppliers for the next-generation "Vera Rubin" platform is in the same vein. The industry is watching whether SK hynix's solo lead will continue through the HBM4 and HBM5 generations or whether Samsung Electronics will reclaim the initiative by leveraging next-generation technologies, which is seen as the biggest variable for the market ahead.