LG Innotek said on the 27th that it will take part in the 2026 Electronic Components Technology Conference (ECTC) and unveil next-generation semiconductor substrate technologies to global semiconductor corporations.
Marking its 76th year, the Electronic Components Technology Conference is the world's largest international conference in semiconductor packaging hosted by the Institute of Electrical and Electronics Engineers (IEEE). This year's event runs for four days from the 26th to the 29th (local time) in Orlando, Florida.
About 2,000 industry officials from more than 20 countries are expected to attend. One hundred thirty-five leading global semiconductor corporations, including Intel, Amkor, ASE and IBM, will also participate to share the latest trends in semiconductor packaging technologies.
LG Innotek is participating in the Electronic Components Technology Conference for the first time this year and will operate a separate exhibition booth during the event. For global big tech customers, it will showcase two large-area flip-chip ball grid array (FC-BGA) substrate samples currently under development and differentiated technologies applied to the products.
With the spread of training and inference AI and increased token (basic computation unit) usage by AI agents, semiconductor chip performance is becoming more advanced. To process massive amounts of data quickly, high-spec chips need more circuits and components mounted on substrates. This is why FC-BGA substrates are increasing in layer count and circuit density and expanding in area.
At this Electronic Components Technology Conference, LG Innotek will display a large-area FC-BGA substrate measuring 85 mm by 85 mm, along with an extra-large FC-BGA substrate sample with an area about 40% larger. The large-area FC-BGA applies chip embedding technology. Unlike the conventional method of mounting a chip on top of the substrate, this technology buries the chip inside the substrate. As the signal travel distance shortens, electrical resistance generated during power delivery is reduced by about 25%. This can help lower power loss in servers and improve power efficiency.
LG Innotek will also unveil a 5G Network radio frequency system-in-package (RF-SiP) substrate that integrates its proprietary technologies accumulated over more than 50 years. As smartphone performance advances, more components are being additionally installed in the device. That has made it harder to reduce smartphone thickness. LG Innotek drew industry attention by applying, for the first time in the world, the copper post (Cu-Post) process that changed the paradigm of communication semiconductor substrate technology to this product.
Cu-Post is a technology that connects the substrate and the mainboard by erecting tiny copper posts on the semiconductor substrate and placing solder balls on top. The pillar structure allows solder balls to be arranged more densely, increasing circuit density. Substrate thickness can be reduced by nearly 20% compared with conventional methods. It is a technology that helped solve an industry challenge that hindered the realization of high-performance, ultra-slim smartphones.
Cho Ji-tae, head of the package solutions division (executive vice president) at LG Innotek, said, "We believe the Electronic Components Technology Conference will be an important opportunity to promote LG Innotek's next-generation substrate technology competitiveness to global customers and expand new partnerships and business opportunities," adding, "We plan to foster the package solutions business into a core business worth more than 3 trillion won by 2030, led by high value-added semiconductor substrates with strong global market demand."