SK hynix unveiled next-generation technology that reduces heat by inserting a cooling element inside a high bandwidth memory (HBM) package.
On the 26th, SK hynix said it introduced "iHBM," a technology that embeds an integrated cooling element, ICE, in an HBM package. ICE is a cooling element that creates an additional heat dissipation path inside HBM by using a silicon material with high thermal conductivity that does not conduct electricity.
As demand for AI computation grows, HBM is moving toward higher stack counts and faster speeds. However, the higher the performance, the greater the heat generation becomes. In particular, heat control in the "D2D PHY" section that links the HBM base die and AI high-speed chip is emerging as the key to next-generation HBM competitiveness.
SK hynix's iHBM is characterized by inserting ICE into this section to create a dedicated path for heat to escape. The company said this lowers thermal resistance by more than 30% compared with existing solutions and maintains stable operation even in high-temperature, high-load environments.
High-volume manufacturability has also been verified. SK hynix said mass production is possible by applying a wafer-level packaging process based on MR-MUF, which has already been validated in the market. It added that it can be applied without major design changes due to high compatibility with customers' existing system-package environments.
SK hynix plans to apply iHBM technology starting with next-generation products such as HBM5. Through this, it aims to enhance the thermal management performance required in AI data centers and high-performance computing environments and to strengthen system stability and operational efficiency.
Vice President Lee Kang-uk of SK hynix said, "iHBM is a heat-minimizing solution that combines memory design capabilities with advanced packaging technology," adding, "We will further solidify our AI memory leadership."