Semiconductor equipment corporations Applied Materials said on the 7th that it signed a definitive agreement with ASMPT to acquire the NEXX business unit. NEXX operates in the field of large-area advanced packaging deposition equipment for the semiconductor industry.
Applied said, "With the addition of the NEXX team and product portfolio, we will further expand our panel-level advanced packaging capabilities," adding, "Chipmakers and system corporations will implement energy-efficient, high-performance large artificial intelligence (AI) accelerators."
With the spread of AI, demand is rising for the design of "large chiplets" that integrate graphics processing units (GPUs), high bandwidth memory (HBM) stacks, and input/output (I/O) chips into a single advanced package. To build large AI chips and increase output, the industry is shifting from conventional 300 mm silicon wafers to panel form factors of 510×515 mm or larger.
Applied has a manufacturing portfolio that spans digital lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD), etch, and electron-beam (eBeam) metrology and inspection. The company plans to expand its business scope by adding NEXX's panel-level electrochemical deposition (ECD) technology.
Prabu Raja, president of Applied's Semiconductor Products Group (SPG), said, "The addition of NEXX will complement and strengthen Applied's leadership in advanced packaging, particularly in panel processing, which will present enormous opportunities for co-innovation and growth with customers over the coming years," adding, "Together with the combined customer base of both companies, we look forward to opening a new chapter in advanced packaging technology."
Jarek Piserra, president of ASMPT NEXX, said, "NEXX products are already highly competitive," adding, "Within Applied, we will continue to focus on innovation, quality, and excellent customer service as we pursue growth."