HANMI Semiconductor said on the 4th that it will participate in the "2026 Semicon Southeast Asia" exhibition and introduce its new equipment scheduled for release this year, the "2.5D TC Bonder 40" and "2.5D TC Bonder 120." The 2026 Semicon Southeast Asia, hosted by the International Semiconductor Equipment and Materials Association (SEMI), will run from the 5th to the 7th at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur.
The 2.5D TC Bonder series is packaging equipment that integrates multiple chips such as a graphics processing unit (GPU), central processing unit (CPU), and high bandwidth memory (HBM) into a single package on a silicon interposer. HANMI Semiconductor will use this new product tailored to the artificial intelligence (AI) market to begin in earnest expanding its business scope from TC bonders for HBM production to 2.5D packaging.
HANMI Semiconductor's "2.5D TC Bonder 40" enables chip and wafer bonding in sizes of 40 mm × 40 mm. The "2.5D TC Bonder 120" also supports large interposer packaging in wider sizes such as wafers and substrates.
A representative 2.5D packaging technology is TSMC's CoWoS (Chip on Wafer on Substrate). CoWoS is a core technology in AI Semiconductor and high-performance computing (HPC), and global AI Semiconductor corporations such as Nvidia and AMD are actively adopting it.
According to global market research firm Yole Group, the advanced packaging market, including 2.5D and 3D, is expected to grow at an average annual rate of 9.5%, from $46 billion (about 67.6476 trillion won) in 2024 to $79.4 billion (about 110.1479 trillion won) in 2030.
HANMI Semiconductor will also showcase its flagship equipment at the exhibition, including the 7th-generation "Micro Saw Vision Placement (MSVP) 6.0 Griffin." The 7th-generation MSVP features a significant boost in productivity by incorporating more than 207 patents and unmanned automation technology. Since launching the first-generation MSVP in 1998, HANMI Semiconductor has ranked No. 1 in the world for 23 consecutive years since 2004. MSVP is essential semiconductor production equipment that performs cutting, cleaning, drying, inspection, sorting, and loading of semiconductor packages.