Samsung Electronics said at its first-quarter 2026 earnings conference call on the 30th that it is pursuing an expansion of orders centered on AI and HPC (high-performance computing) for the foundry business over the mid to long term.
It added, "As the memory supply shortage continues, more customers are seeking to secure turnkey (end-to-end production) demand, and accordingly, cooperation on the 2-nanometer process is being visibly secured, centered on AI and HPC customers," noting, "With some customers, specific cooperative results are anticipated."
It also said, "The HBM4 base die based on the 4-nanometer process is driving demand as it is recognized for differentiated competitiveness with excellent performance," adding, "To respond, we are actively reviewing plans to expand supply."
In addition, "We are discussing the adoption of the 2-nanometer and 4-nanometer processes with automotive and Robotics customers, mainly in the Americas and Greater China, and we are working to verify our technology and secure reliability through products from key counterparties."
Investment in next-generation technologies is also underway in parallel. Samsung Electronics said, "As demand for high-bandwidth, low-power data transmission in data centers increases, demand for silicon photonics is also expanding," adding, "We are developing whole-package technology that combines not only devices but also advanced processes and 3D Packaging, and we are discussing commercialization with major global customers."
It added, "In optical communication modules, we plan to begin mass production from the second half of 2026 through cooperation with a major global customer," noting, "We expect to secure competitiveness across various applications through collaboration with domestic fabless companies and participation in government-led projects, contributing to mid- to long-term revenue growth."