DB HiTek, an 8-inch foundry specialist, said on the 29th that it will take part in Europe's largest power semiconductor exhibition, "PCIM (Power Conversion and Intelligent Motion) 2026," to be held in Nuremberg, Germany, from June 9 to 11 (local time).

A view of the DB HiTek Bucheon campus./Courtesy of DB HiTek

DB HiTek first participated in PCIM last year, holding in-person meetings with dozens of client companies, introducing technology for key processes, and discussing cooperation plans. More than 1,000 people visited the booth at the time, and as follow-up commercialization with the client companies that held meetings then moves into full swing, visible results are expected starting this year.

At this exhibition as well, DB HiTek will share the latest development status of SiC (silicon carbide) and GaN (gallium nitride) processes, which are drawing attention as next-generation power semiconductors, and will showcase technology centered on its BCDMOS (bipolar-CMOS-DMOS) process, for which it has secured industry-leading capabilities. Meetings with a variety of client companies are also scheduled, which is expected to expand future cooperation opportunities.

According to market research firm Yole Développement in the semiconductor and electronics sector, the global SiC and GaN power semiconductor markets are expected to see rapid growth. The SiC market is projected to expand from about $4.8 billion in 2026 to about $10.4 billion in 2030, growing at an average annual rate of about 21%. Over the same period, the GaN market is also projected to expand from about $900 million in 2026 to about $2.9 billion in 2030, growing at an average annual rate of about 33%.

DB HiTek conducted multi-project wafer (MPW) runs based on SiC and GaN processes in Dec. 2025, producing products for more than 10 client companies each, and delivered them to clients in Mar.–Apr. 2026. Client evaluations are underway, and the company plans to finalize the processes reflecting the feedback. Mass production of SiC and GaN processes is slated to begin in 2027.

Meanwhile, DB HiTek is currently in mass production with about 400 client companies, centered on power semiconductors, its mainstay products. In addition, it is working with various client companies based on specialized image sensor process technologies such as X-ray, global shutter, and SPAD (single-photon avalanche diode). The share of industrial and automotive applications continues to increase.

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