HANMI Semiconductor recently criticized the patent lawsuit with Hanwha Semitek as an attempt to undermine the value of the original technology.
According to the company, HANMI Semiconductor completed the world's first development in 2016 of the thermal compression (TC) bonder, a key piece of equipment for producing high-bandwidth memory (HBM), and in 2017 became the first in the industry to supply it to customers, setting the market standard. It currently ranks No. 1 in global TC bonder market share and, focusing on strengthening intellectual property rights since 2002, holds 163 patents related to HBM equipment, including those planned for filing.
HANMI Semiconductor characterized the lawsuit filed by Hanwha Semitek as an attempt to damage the rightful value of original technology recognized in the global market. It is particularly concerned that a baseless legal offensive by a latecomer against a leading company with original technological capabilities could undermine the industry's innovation ecosystem.
In response, HANMI Semiconductor plans to pursue an active legal defense. Because noninfringement of the relevant patent is clear, HANMI Semiconductor is seeking to conclude the main lawsuit rather than using alternative strategies such as a "patent invalidation trial," which could end the case quickly. HANMI Semiconductor said it has secured sufficient prior user rights materials and invalidation materials regarding the patent claimed by Hanwha Semitek.
A company official said, "We will protect our legitimate rights to the end through legal procedures and respond firmly to any attempts by external corporations to steal technology."