An analysis said SK hynix has adopted hybrid bonding early to launch HBM5, the eighth-generation high-bandwidth memory (HBM), in 2029.
On Apr. 6, market research firm Counterpoint Research said SK hynix adopted an integrated hybrid bonding solution from Applied Materials and BE Semiconductor Industries (BESI) ahead of schedule. It said the company is securing a strategic edge that can meet a range of performance needs, including bandwidth, latency, power, and speed.
Counterpoint Research said that while thermal compression bonding (TCB) can be used for up to 16 stacks in HBM thanks to relaxed standards by the Joint Electron Device Engineering Council (JEDEC), major players such as Nvidia are demanding higher bandwidth and efficiency, making the adoption of hybrid bonding inevitable in the long term. It said major memory semiconductor corporations including Samsung Electronics, SK hynix, and Micron are pushing to introduce hybrid bonding starting with HBM4 to meet next-generation AI demand. Hybrid bonding reduces die-to-die spacing and stack height, easing physical height and integration constraints in graphics processing unit (GPU) packages.
Counterpoint Research said, "HBM5 will be the real turning point for hybrid bonding," adding, "We expect SK hynix to launch HBM5 around 2029–2030 in line with the next AI GPU cycle," and noted, "The introduction of hybrid bonding equipment is expected to provide a key strategic edge in maintaining leadership in the HBM market."