U.S. semiconductor corporations Texas Instruments Incorporated (TI) unveiled two new isolated power modules that raise power density and can be applied to data centers and electric vehicles: UCC34141-Q1 and UCC33420.
TI unveiled the new isolated power modules at the Applied Power Electronics Conference (2026 APEC), a power and electronics technology expo being held in San Antonio, Texas, from the 22nd to the 26th (local time). TI Korea held a press briefing on the 24th to introduce the performance of the new products and the technologies applied to them.
Park Su-min, who oversees analog technical support at TI Korea, said of the products, "Compared with previous models, we cut size by 70% to deliver three times higher power density," and "They are suited for electric vehicles that must fit more battery capacity and boost output in limited space, and for data centers where exploding demand for artificial intelligence (AI) and cloud services has increased the need to raise compute per rack (the frame that holds servers, networking and other equipment)."
An isolated power module is a device that allows power to be supplied while keeping the input and output sections electrically separated. It can change voltage while minimizing effects on other components. It is a key component used in medical devices, servers, electric vehicles and industrial control equipment, where sensitive circuits are used.
While the performance of devices that use isolated power modules is rising, chip size is nearing physical limits. As a result, there is a trend toward boosting power integration density through packaging technologies. Park noted, "We must raise power density while solving heat, electromagnetic interference (EMI) and reliability issues, and we also need to factor in size advantages."
To develop isolated power modules that deliver high power in small spaces while cutting area, expense and weight, TI combined its magnetic packaging solution MagPack and its multi-chip packaging solution IsoShield. MagPack integrates an inductor (coil), which evens current, inside the integrated circuit (IC) package to reduce size. It optimizes space utilization through a three-dimensional (3D) molding process. IsoShield bundles the transformer, which safely isolates electricity, with the power circuitry. It also implements a distributed power architecture to prevent a single point of failure.
Park said, "By applying TI's proprietary packaging technologies MagPack and Aoshield, we introduced new modules that are 43% smaller than competitors' and reduce bill of materials (BOM) count by about 50%," adding, "The transformer height in existing devices is around 11 mm, but the new product cuts it to 2.65 mm. It also enables printed circuit board (PCB) production tailored to the overall case height." Park added, "These products provide the small, efficient and highly reliable solutions power design engineers need."