Microchip Technology said on the 20th that it has released the BZPACK silicon carbide power module (mSiC), which meets the high-humidity, high-voltage, high-temperature reverse-bias (HV-H3TRB, moisture resistance reliability test) standard.
The company said the product "simplifies manufacturing processes based on high reliability and provides various system integration methods to cope with demanding power conversion environments." It is supplied in circuit topologies such as half-bridge, full-bridge, three-phase, power integrated module (PIM), and converter integrated bridge (CIB), allowing developers to optimize performance, expense, and system architecture.
The BZPACK mSiC power module passed the HV-H3TRB test that exceeds the 1,000-hour standard. A case with a comparative tracking index (CTI, insulation performance indicator) of the 600V class was also applied. Stable on-resistance (Rds(on), turn-on resistance) characteristics were secured across the entire temperature range. It offers substrate options of aluminum oxide or aluminum nitride.
Clayton Pillion, vice president of Microchip's High-Power Solutions business unit, said, "The BZPACK mSiC power module demonstrates Microchip's commitment to delivering a robust, high-performance solution even in demanding power conversion environments."