LG Electronics' VS business unit said on the 25th it will unveil a next-generation smart telematics solution that integrates a TCU for in-vehicle communications and an antenna into a single module at MWC 2026, the world's largest mobile communications exhibition, to be held in Barcelona, Spain, for four days starting on the 2nd of next month (local time).
This is the first time the VS business unit is participating in this exhibition. As the automotive industry paradigm shifts from software-defined vehicles (SDV) to AI-defined vehicles (AIDV), in-vehicle communications technology has emerged as the core of mobility competitiveness. It is part of efforts to strengthen strategic collaboration with automakers and telecom operators seeking next-generation communications solutions in line with the advancement of Autonomous Driving and infotainment.
LG Electronics will operate a private booth for B2B customers, including automakers. As the world's No. 1 telematics provider, it will accelerate the discovery of potential customers and the expansion of business opportunities with innovative solutions based on leading technology.
The next-generation smart telematics solution maximizes system efficiency by integrating into a single module the antenna that collects various external signals—such as 5G, GPS, V2X (vehicle-to-everything), and satellite communications—and the TCU that converts the collected signals into data and delivers them to internal software.
LG Electronics directly designed and optimized core components, reducing component size while advancing signal-processing algorithms.
LG Electronics integrated components that had been installed in separate locations, minimizing signal loss that occurs at intercomponent connection sections. It processes not only the vast data coming from outside the vehicle but also data from IT devices connected inside the vehicle quickly and reliably. It also features industry-leading security that meets international standards and regulations.
With a simplified in-vehicle wiring structure and spatial layout design, the efficiency of automotive assembly processes also improves. In addition, it can eliminate the shark-fin antenna that protruded outside the vehicle, enabling a sleek exterior design.
Eun Seok-hyun, head of LG Electronics' VS business unit (president), said, "In the field of in-vehicle communications that has become the core of mobility competitiveness, we will continue to introduce innovative solutions based on our world No. 1 telematics technology and lead the era beyond SDV to AIDV."