HANMI Semiconductor said on the 11th that it will participate as an official sponsor at the "2026 Semicon Korea" exhibition and unveil the Wide TC BONDER.
Semicon Korea is the country's largest semiconductor exhibition organized by the Semiconductor Equipment and Materials International (SEMI). It opens that day and runs through the 13th at COEX in Samseong-dong, Seoul. This year's event featured about 2,400 booths from 550 corporations showcasing technology.
The Wide TC bonder unveiled by HANMI Semiconductor that day is equipment designed for producing next-generation high bandwidth memory (HBM5·6). The company said, "It is next-generation HBM production equipment slated for release in the second half of this year," adding, "It is drawing attention as a new type of TC bonder that can fill the gap of mass-production hybrid bonders (HB) for HBM, whose commercialization has been delayed by technical challenges." The company said the equipment applies advanced precision bonding technology that can improve HBM Production yield, quality and completeness.
As the HBM die area expands, the number of through-silicon vias (TSVs) and input/output interfaces (I/Os) can be increased, improving power efficiency compared with high-stacking methods. The number of micro bumps connecting the DRAM die and the interposer also rises, making it suitable for securing memory capacity and bandwidth.
HANMI Semiconductor's "Wide TC bonder" can add a fluxless bonding function as an option. It is a technology that reduces the oxide layer on the chip surface without flux to increase bonding strength. This can reduce HBM thickness.
Starting early this year, major memory semiconductor corporations are commencing full-scale mass production of HBM4 (6th generation). With HBM5 and HBM6 development ahead, the company expects increased demand for new TC bonders. Market research firm TechInsights forecast that the TC bonder market for HBM will grow at an average annual rate of 13.0% from 2025 to 2030.
At this exhibition, HANMI Semiconductor also presented a "Wide TC bonder array diagram" artwork along with a collaborative artwork with pop artist Philip Colbert. Following the Semicon Korea exhibition, HANMI Semiconductor will also participate as an official sponsor in Semicon China in March, Semicon Southeast Asia (Malaysia) in May, and the Semicon Taiwan exhibition in September.