HANMI Semiconductor said on the 9th that after releasing the TC Bonder4 for producing sixth‑generation high bandwidth memory (HBM4) last year, it plans to launch a "wide TC bonder" for producing HBM5 and HBM6 in the second half of this year.
HANMI Semiconductor said the wide TC bonder is drawing attention as a new type of TC bonder that supplements the gap in hybrid bonders (HB) for mass production of HBM, which have not yet been commercialized due to technical challenges.
Based on its original HBM hybrid bonder technology developed in 2020, HANMI Semiconductor is communicating with customers to launch a next‑generation advanced hybrid bonder in line with the expected timing for mass production of HBM with 16 or more stacks in 2029.
This year, the global artificial intelligence (AI) semiconductor market is expected to see a significant year‑over‑year increase in capital expenditures by global memory corporations due to surging HBM demand.
Recently, market research firm TechInsights projected that the TC bonder market will grow by about 13.0% annually from 2025 to 2030.
Micron has said it raised this year's capital expenditures to $20 billion (about 29.3 trillion won) from the previous $18 billion (about 26.4 trillion won) and plans to significantly expand HBM production capacity.
Such aggressive investment is expected to contribute to sales growth of HANMI Semiconductor's TC bonder, which was recognized last year by Micron as a top partner and received the "Top Supplier" award.
In addition, HANMI Semiconductor plans to launch a variety of new bonding equipment this year in the AI system semiconductor field and supply them to foundries and OSAT (outsourced semiconductor assembly and test) corporations in China and Taiwan.
A HANMI Semiconductor official said, "Buoyed by increased HBM demand this year, we can set new record results this year and next," adding, "We will further strengthen our leadership in the global semiconductor equipment market by developing next‑generation products and expanding production capacity."
On the 6th, HANMI Semiconductor disclosed that, on a consolidation basis, last year's operating profit was 251.4 billion won, a 1.6% decrease from a year earlier in a provisional tally. Revenue was 576.7 billion won, up 3.2% year over year, setting an all‑time high for the second straight year following 2024. However, fourth‑quarter operating profit was 27.6 billion won, down 61.6% from the same period a year earlier.