TSMC is reportedly planning to build the world's largest advanced packaging (AP) base in Taiwan.
According to Taiwan media including Economic Daily News on the 5th, the Ministry of Climate, Energy and Environment said that at the 45th Environmental Impact Assessment Review Committee held the previous day, the environmental impact assessment for the "Chiayi Science Park expansion construction phase 2 development plan" promoted by the Southern Taiwan Science Park Administration had won final approval.
With the environmental impact assessment completed the previous day for the planned construction site in Taibao, Chiayi County, in the southwest, spanning 89.58 hectares (1 hectare is 10,000 square meters), TSMC is expected to build three additional 3D SoIC advanced AP plants from the first half of this year as early as through 2031. SoIC is TSMC's 3D heterogeneous chip integration packaging technology that vertically stacks multiple chips to maximize performance and power efficiency.
Following AP Plant 1 (P1) and Plant 2 (P2) under construction in the Chiayi Science Park, TSMC's move to add AP Plants 3 to 5 (P3 to P5) is expected to turn the park into the world's largest advanced packaging base.