Microchip Technology said on the 4th that it has released the MCPF1525 power module, a highly integrated device with a 16V input voltage (Vin) buck converter.
It delivers 25A per module and can be stacked for expansion up to 200A. The company said of the MCPF1525 that "it enables higher power delivery within the same rack space" and "combines programmable PMBus and I2C control features." It can also drive the latest-generation PCIe switches needed for artificial intelligence (AI) and high-performance computing MPU applications.
The MCPF1525 can reduce board area by up to 40% compared with other solutions through a vertical packaging structure. This compact power module measures about 6.8 mm × 7.65 mm × 3.82 mm.
Microchip said it released the product to meet rising demand for higher-power solutions as AI and high-performance computing (HPC) workloads grow.
Rudy Jaramillo, vice president of Microchip's analog power and interface business unit, said, "The MCPF1525 power module can help customers achieve the system efficiency, reliability and scalability required for high-performance data center and industrial computing applications."