Samsung Electronics said at a fourth-quarter 2025 earnings conference call on the 29th, "Seventh-generation HBM (HBM4E) is scheduled to supply samples to customers in the middle of this year. Customized HBM is also scheduled to begin initial wafer input in the second half," adding, "We have sent customers samples of HBM4 applying hybrid bonding technology, and starting with HBM4E, some commercialization is expected."
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