As commercialization of glass substrates, considered a core technology for next‑generation semiconductor packaging, approaches, SK, LG, Samsung and others are rapidly expanding partnerships with materials and process companies. Observers say competition is shifting beyond simple technology development to a race to lock in the value chain with mass production in mind.
A glass substrate is a next‑generation packaging technology that uses glass as the key material instead of the organic substrates mainly used in conventional semiconductor packages. Glass has low thermal expansion and high flatness, which favors fine circuit implementation, and it can reduce signal loss and improve power efficiency. As high‑performance, high‑density chips such as AI semiconductors spread, precision and stability at the packaging stage determine performance, leading the industry to view glass substrates as a strong alternative for next‑generation packaging.
According to the industry on the 16th, within SK Group, SKC is accelerating preparations for mass production of glass substrates with subsidiary Absolics at the center. Behind SKC's push into the glass substrate business are structural limits in its existing main businesses. With petrochemicals sluggish and weighing on results, the company is seen as selecting glass substrates as a high value‑added packaging material that can grow alongside the spread of AI Semiconductor. The judgment is that whether it enters mass production itself, rather than short‑term revenue, is the inflection point for mid‑ to long‑term business reorganization.
Absolics is diversifying suppliers by adding a domestic materials company for glass‑substrate photoresist (PR), which had relied on Japan's TOK, and is reviewing process dualization by seeking additional partners for TGV (through‑glass via) and plating processes beyond existing collaborators. With mass production targeted for this year, securing supply stability as well as technical completeness is cited as a key task.
Samsung also sees glass substrates as part of its next‑generation packaging competitiveness and has moved to secure the value chain. Samsung Electro-Mechanics is pushing to establish a joint venture (JV) with Japan's Sumitomo Chemical for glass core, a key glass substrate material, and Samsung Electronics is investing in domestic glass substrate specialist JWMT through Samsung Venture Investment to support facility expansion and capacity growth. It is interpreted as an attempt to build a step‑by‑step structure spanning materials, processing and substrates.
At LG, LG Innotek is reviewing glass substrates as an extension of its existing substrate and packaging business. After investing in UTI, which has glass precision‑processing capabilities, it is jointly developing technology to strengthen glass substrates and has built a pilot production line to check mass‑production feasibility step by step. Considering synergies with existing businesses, the strategy is interpreted as securing core processes in‑house while pursuing external technology collaboration in parallel.
The industry points to the complexity of glass substrate processes and the imminent mass‑production timetable as the background for these moves. Glass substrates involve high difficulty by process—PR, glass core, TGV, plating, tempered‑glass processing—making it time‑consuming and burdensome for a single company to build all processes in‑house, critics say. In particular, as mass‑production schedules for major players become clearer, there is growing need to build partnerships to prepare for the phase of stably ramping production volume and Production yield after customer qualification.
An industry official said, "The glass substrate race is less about who secures the technology first and more about who completes a structure premised on mass production first," adding, "In the early stage, Production yield stability and supply reliability are crucial, so it is inevitable to collaborate by dividing roles among multiple specialized companies rather than centering on a single corporation." The official added, "As demand for high‑performance packaging is rising quickly with the spread of AI Semiconductor, corporations that preemptively build the value chain are highly likely to seize medium‑ to long‑term market leadership."