Semes, a semiconductor equipment company, said on the 16th that it has developed for mass production, for the first time in Korea, the TEPAS100, a sorter for large semiconductor panel-level package (PLP) production.
The TEPAS100 is equipment that singulates raw material packages, inspects finished semiconductor chips with vision to distinguish good products from defects, and sorts them into trays using high-speed, high-precision testing technology. The significance of this equipment is that it can dice and control packages from large 515x510 mm panels.
The company said it secured differentiated competitiveness in productivity and quality control by applying its proprietary specialized Tornado Blower method, which enables high-speed drying of large areas during the cleaning and drying process after singulation into packages.
Choi Byung-gap, TP team leader at Semes, said, "As demand for higher integration and larger sizes in semiconductor packaging has risen across various applications recently, PLP technology that leverages large panels is drawing attention," and added, "Semes plans to complete its equipment lineup from legacy packages and wafer-level package (WLP) to panel-level package (PLP) equipment and strengthen its position in the global semiconductor packaging market."