Lee Myung-ho, vice president of HANMI Semiconductor./Courtesy of HANMI Semiconductor

HANMI Semiconductor said on the 14th that it has hired semiconductor expert Lee Myeong-ho, formerly of Apple, as executive vice president.

Lee, as executive vice president, will oversee development and sales at HANMI Semiconductor and focus on strengthening new product and technology development. The company said it expects Lee's appointment to lead to an expanded global customer base and stronger strategic collaboration.

Lee is a veteran with more than 25 years of experience in semiconductors. Lee worked at Apple, Texas Instruments (TI), JCET, StatsChipPAC, and Amkor Technology, among other global semiconductor corporations. Based on hands-on experience covering product development, process technology, quality, and manufacturing, Lee led the development and mass production of a wide range of advanced semiconductor packaging technologies from lead frame to INFO.

At Apple, Lee worked for about 10 years from 2014, overseeing semiconductor packaging development for application processors (AP) used in major products including the iPhone, Apple Watch, and iPad. Lee also has experience overseeing battery protection circuit (BMU) development. In the process, Lee demonstrated technological competitiveness, including holding a U.S. patent related to EMI shielding (USPTO 9793222).

At Texas Instruments (TI), Lee worked for about 10 years from 2004, leading various global projects including Nokia as an engineering manager. Lee led next-generation packaging technology development and was appointed as the first technology expert committee member (MGTS) from an outsourced development organization.

At JCET and StatsChipPAC, Lee served as head of product development, leading program development with global customers such as Nvidia, Broadcom, and IBM, and achieved outstanding results in packaging and materials technology development at Amkor Technology.

A HANMI Semiconductor official said, "Lee's addition will be an important turning point that elevates our capabilities in responding to global customers and our competitiveness in next-generation semiconductor technologies," adding, "We expect it will further solidify our position in the global market."

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