LG Innotek said on the 8th that it signed a research and development collaboration with UTI, a specialist in precision glass processing, to strengthen its glass substrate business competitiveness, a next-generation technology that will reshape the semiconductor packaging market.
The two sides plan to jointly develop technology to increase the strength of glass substrates, the next-generation semiconductor substrate.
Unlike existing plastic (organic) substrates, a glass substrate replaces the core layer inside the substrate with glass, making glass reinforcement technology a key task. UTI has manufacturing capabilities for mobile-strengthened glass that is thin yet highly durable.
LG Innotek has built a pilot production line for glass substrates at its domestic business sites and is accelerating technology development through collaboration with global customers and companies at home and abroad that possess glass substrate technology.
In particular, the company plans to apply glass substrate technology to FC-BGA (flip-chip ball grid array), a high-value semiconductor substrate it has recently focused on, to strengthen business competitiveness.
President Moon Hyuk-soo said, "LG Innotek will continue to unveil innovative products that create outstanding customer value by adding precision glass processing technology to the substrate materials expertise built over 50 years."
Meanwhile, LG Innotek has selected high-value substrates for artificial intelligence (AI), semiconductors, and telecommunications as new business areas to drive future growth, with a goal of expanding annual revenue to 3 trillion won by 2030.