HANMI Semiconductor has introduced a credit program that accrues a set percentage of purchase amounts, the first of its kind in the global semiconductor equipment industry. The decision reflects an intent to strengthen customer loyalty and cement long-term partnerships.
HANMI Semiconductor said on the 2nd that it implemented the HANMI Credit System (HCS) on the 1st of this month. Each time a customer orders semiconductor equipment, 2% of the order amount is accrued as credits in the form of points.
Accrued credits are automatically generated once payment is made in full after equipment shipment. When a certain amount has accumulated, they can be used like cash for the next equipment purchase. The validity period is five years from the accrual date.
The program was prepared as a token of appreciation for more than 320 customers worldwide. A HANMI Semiconductor official said, "Introducing the industry's first credit program reflects our intent to express gratitude to customers and build a long-term partnership for shared growth," adding, "We will provide tangible value to customers and strengthen competitiveness in the global market."
HANMI Semiconductor's technical roots stem from founder Gwak No-gwon's 14 years of experience at Motorola Semiconductor in the United States beginning in 1967. The company currently ranks No. 1 worldwide with a 71% market share in the thermal compression (TC) bonder market for high bandwidth memory (HBM), a core of artificial intelligence (AI) semiconductors. Having focused on securing intellectual property since 2002, it holds 150 HBM equipment-related patents, including those scheduled for filing.
Its strategy to widen the technological gap is also gaining speed. The company preemptively established mass production for the "TC Bonder 4" for HBM4 in July last year. It plans to release a "Wide TC Bonder" for next-generation HBM at the end of this year.