Bos Semiconductor said on the 24th that it will take part in CES 2026, the world's largest IT and home appliance show, held in Las Vegas from Jan. 6 to 9 (local time), to unveil an AI Box demo for next-generation mobility.
At this exhibition, Bos Semiconductor will present a strategy responding to industry trends such as Autonomous Driving, the shift to software-defined vehicles (SDV), and the spread of physical AI. Through this, it will introduce solutions to key challenges required in the mobility AI environment.
To that end, Bos Semiconductor will unveil various AI model demos based on an AI Box that applies the high-performance AI accelerator Eagle-N. The AI Box is an external AI computing module that allows original equipment manufacturer (OEM) automakers to add an "AI brain" to vehicles without replacing the in-vehicle infotainment (IVI) systems they already use, a new technology that has recently drawn attention.
By using the AI Box, automakers can expand high-performance AI functions separately while keeping existing systems as much as possible. This enables the rapid application of the latest AI features not only to new vehicles but also to model-year updates that improve the appearance and functions of existing vehicles, allowing them to continuously strengthen vehicle competitiveness while reducing development expense and time burdens.
The AI Box also offers various advantages based on an on-device AI architecture that performs AI computation independently inside the vehicle. Bos Semiconductor noted that by processing sensitive data such as voice and video directly inside the vehicle without sending it to the cloud, it has strengths in terms of privacy protection and data security.
Stable AI operation is possible regardless of network connectivity, ensuring high reliability that is not affected by the communication environment. From a long-term perspective, the AI Box can reduce cloud traffic, inference, and storage expense to lower total cost of ownership (TCO).
Bos Semiconductor's AI Box flexibly links with existing in-vehicle systems through various interfaces. This allows functions that require high-performance AI computation to be handled by a separate AI Box, while existing systems maintain their respective roles, enabling an efficient vehicle AI architecture based on separation of roles.
At Bos Semiconductor's booth at Venetian Expo A–D Hall 50017, it will demonstrate an on-device AI model that combines a vision-language model (VLM) and large language model (LLM) based on this AI Box architecture.
Vice President Chae Jeong-seok, head of strategy marketing at Bos Semiconductor, said, "At CES 2026, through AI Box demos centered on Eagle-N, we will present a practical alternative for effectively expanding AI functions even on existing vehicle platforms," adding, "We will leap forward as a key semiconductor company leading the era of physical AI beyond automotive semiconductors."