HANMI Semiconductor ranked No. 1 in market share for high bandwidth memory (HBM) TC bonders in the third quarter of this year, according to a survey.
According to the "2025 TC bonder market report for HBM" that market research firm TechInsights recently released on the 22nd, HANMI Semiconductor was found to have captured a 71.2% share with cumulative sales of $247.7 million (about 366 billion won) in this field in the third quarter this year.
A TC bonder is key equipment in the HBM manufacturing process that precisely bonds memory chips under high temperature and high pressure. HANMI Semiconductor entered the HBM market in 2017 by launching the world's first "TSV dual stacking TC bonder." It holds all core TC bonder technologies for HBM production, including the NCF (Non-Conductive Film) type and MR-MUF (Mass Reflow-Molded Underfill) type.
HANMI Semiconductor holds a total of 150 patents related to HBM equipment, including those planned for filing. In July, it also set up a mass production system for the HBM4 "TC Bonder 4." By the end of next year, it plans to release a next-generation HBM "wide TC bonder." The company said, "This is the result of our focus on strengthening intellectual property (IP) since 2002," adding, "We will also actively invest in technology in line with changes in HBM packages going forward."
The company is building a hybrid bonder factory in the Juan National Industrial Complex in Seo-gu, Incheon, with a total investment of 100 billion won, with a total floor area of 4,415 pyeong (about 14,571 square meters) and two stories above ground. It aims to complete construction by the end of next year. With this investment, HANMI Semiconductor will complete production lines totaling 27,083 pyeong (about 89,530 square meters). In September, it established an "AI Research Headquarters" to integrate artificial intelligence (AI) technology into "TC bonder equipment," applying process optimization, predictive analytics, and automation.
In the report, TechInsights said, "After a short-term normalization process in 2025, TC bonders are expected to rebound in earnest starting in 2026," and predicted, "They will show strong growth with a compound annual growth rate (CAGR) of about 13% through 2030."
Founded in 1989, TechInsights is a global semiconductor technology analysis and market research firm headquartered in Ottawa, Canada. It has earned recognition for excellence in market outlook analysis for semiconductors and electronic products, as well as chip-level circuit and process technology structure analysis, and enjoys high trust from high-tech corporations and government agencies around the world.