SK hynix 1b 32Gb-based 256GB DDR5 RDIMM./Courtesy of SK hynix

SK hynix said on the 18th that its 256GB DDR5 RDIMM, a high-capacity server DRAM module based on 10-nanometer 5th-generation (1b) 32Gb, has passed Intel's data center certification for application to the Intel Xeon 6 platform, the first in the industry to do so.

An RDIMM is a server and workstation DRAM module that adds a register or buffer chip to relay address and command signals between the memory controller and DRAM chips on the memory module. The certification process was conducted at the Advanced Datacenter Development Lab, Intel's cutting-edge research facility in the United States.

There, SK hynix underwent multiple rounds of multidimensional evaluations and obtained results showing that the product delivers reliable performance, compatibility and quality when combined with the Xeon platform. Earlier, on Jan. 1, SK hynix also obtained certification for a 256GB product based on 10-nanometer-class 4th-generation (1a) 16Gb.

SK hynix said, "We became the first in the industry to verify compatibility with Intel's latest server platform, which leads the server CPU market, proving our world-class high-capacity DDR5 module technology," and added, "Building on this, we will expand collaboration with major global data center operators and respond in a timely manner to surging server demand to continue our leadership in the next-generation memory market."

In next-generation artificial intelligence (AI) infrastructure, memory is emerging as a key factor that determines performance. As recent AI inference models move beyond simply generating answers to performing complex logical reasoning processes, the amount of data processed in real time is growing exponentially. In addition, to process vast amounts of data quickly and stably, high-capacity, high-performance memory is essential, and market demand is surging accordingly. According to global market research firm IDC, the global server market this year is expected to reach $366 billion (about 494 trillion won), up 44.6% from the previous year.

SK hynix explained that when a server adopts 32Gb 128GB products, inference performance improves by 16% compared with before, while power consumption decreases by about 18% compared with existing 1a-based 16Gb 256GB products.

Lee Sang-kwon, executive vice president of SK hynix in charge of DRAM product planning, said, "We have solidified our leadership in the server DDR5 DRAM market and can respond quickly to customer needs," and added, "As a full-stack AI memory creator, we will actively respond to the growing demand for high-performance, low-power, high-capacity memory to drive customer satisfaction."

Dimitrios Giakas, Intel's vice president of platform architecture, said, "Through close collaboration, the two companies improved technological completeness, achieved strong results and contributed to advances in memory technology," and added, "High-capacity modules will meet the surging demand for AI workloads and greatly enhance the performance and efficiency that data center customers want."

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