Boss Semiconductor, a specialized fabless corporations for vehicle, robot and Physical AI semiconductors, and LIG Nex1, a leading corporations in advanced defense and robot technologies, said on the 17th that they signed a strategic memorandum of understanding (MOU) on Nov. 28 to accelerate the development and commercialization of Physical AI solutions for robots and drones.
The agreement was made under the two companies' shared vision of securing Physical AI and On-device AI technologies that will drive innovation in next-generation intelligent robot and drone technologies.
Physical AI is a technology that embeds AI models directly into devices so that the devices can recognize, judge and move autonomously in physical spaces. Physical AI also reduces reliance on cloud computing and performs real-time perception, inference and control on the device itself, minimizing latency and greatly improving security and power efficiency.
Thanks to these characteristics, Physical AI is establishing itself as a foundational technology that meets the core performance requirements of robots and drones that operate autonomously in unmanned environments, and is rapidly emerging as a next-generation technology paradigm.
Through this collaboration, Boss Semiconductor and LIG Nex1 will secure technological competitiveness in AI Semiconductor and high-performance SoC optimized for drone and robot platforms, and plan to lead the development of advanced intelligent unmanned systems in various sectors such as defense, industry and logistics.
Under the agreement, the two companies decided to pursue ▲ development of Physical AI semiconductors and robots and drones applying them ▲ joint cooperation on high-performance SoCs to be used in next-generation robots and drones.
Boss Semiconductor will be responsible for developing On-device AI Semiconductor optimized for robot and drone environments, and plans to support the implementation of intelligent unmanned systems based on AI computing technologies specialized for low power and real-time processing. It also plans to strengthen its competitiveness in Physical AI and On-device AI through cooperation on high-performance SoC technologies.