As next-generation AI and Autonomous Driving and the high-performance computing market expand, boosting the importance of High Bandwidth Memory (HBM), an industry seminar on hybrid bonding technology will be held. The Institute of Industrial Education said it will host the "HBM response: business strategies seminar for innovation and a leap forward in AI Semiconductor/Hybrid Bonding technology" in a simultaneous online and offline format on Dec. 12.
Hybrid bonding is a core process that enables high-speed, high-density packaging and is emerging as a strategic technology in the semiconductor industry, where competition over HBM performance is intensifying. Precision bonding equipment technology is also being evaluated as a factor that determines industrial competitiveness, driving demand for related technologies.
The seminar will cover: ▲ hybrid bonding materials and material technology trends and business strategies ▲ case studies of using glass substrates for silicon photonics–based 2.5D and 3D optical packaging ▲ FINE Cut and Hybrid Bonding technologies and TGV (Through Glass Via) processes for HBM4 and HBM5 ▲ analysis of the next-generation AI Semiconductor packaging market and response strategies ▲ hybrid bonding AFM (atomic force microscope) metrology technology and commercialization issues ▲ advanced packaging processes and reliability evaluation based on glass interposers. The seminar runs from 10 a.m. to 4:50 p.m.
An official at the Institute of Industrial Education said, "We hope this seminar will serve as an opportunity to assess the current level of domestic hybrid bonding equipment technology and to seek industrial opportunities."