Intelligent power and sensing corporations onsemi said on the 9th that it released EliteSiC (elite silicon carbide) MOSFETs in the industry-standard T2PAK top-cool package. T2PAK is a type of industry-standard package for efficient cooling of high-performance Power Semiconductor devices. A MOSFET is a semiconductor device that controls current flow with the voltage applied to the gate.
On the new product, onsemi said it will further advance power packaging technology for automotive and industrial applications and will provide the enhanced thermal performance, reliability, and design flexibility demanded by high-power, high-voltage application markets such as electric vehicles, solar infrastructure, and energy storage systems.
Onsemi's 650V and 950V EliteSiC MOSFETs adopting the T2PAK package combine silicon carbide (SiC) technology with a top-cool packaging format. The company is already supplying initial products to major customers. Additional products are planned for release within the year.
As power demand rises in applications such as solar inverters, electric-vehicle chargers, and industrial power supplies, effective thermal management has become a critical engineering challenge. With conventional packaging methods, designers had to choose between thermal efficiency and switching performance. Onsemi's EliteSiC T2PAK solution addresses this by efficiently transferring heat generated on the printed circuit board (PCB) directly to the system cooling infrastructure.
Ogi Jekic, onsemi's vice president and general manager of the SiC institutional sector, said thermal management is one of the important challenges facing power system designers in today's automotive and industrial markets and said onsemi's EliteSiC technology and T2PAK top-cool package provide superior thermal performance and design flexibility.