Chair Gwak Dong-shin of HANMI Semiconductor will acquire $6.2 billion won worth of treasury shares with personal funds.
HANMI Semiconductor said in a disclosure on the 4th that Gwak will purchase treasury shares on the market on the 30th. Once this purchase is completed, Gwak will have acquired a total of 53.48 billion won (686,157 shares) in treasury shares with personal funds since 2023. With this purchase, the equity stake is expected to rise by about 0.05 percentage point (P), from 33.51% to 33.56%.
HANMI Semiconductor holds the world's No. 1 market share in TC bonder equipment, essential for producing HBM, a core component of artificial intelligence (AI) semiconductors. To date, there are about 130 patents related to HBM equipment. The company said, "Chair Gwak's additional purchase of treasury shares is a decision based on confidence in the technology of HANMI Semiconductor's TC bonder in the high bandwidth memory (HBM) equipment market and the company's recent string of results."
HANMI Semiconductor's HBM TC bonder was selected as a "2025 World Class Product," chosen by the Ministry of Trade, Industry and Energy. At the "62nd Trade Day" ceremony on the 4th, it also received the "$300 Million Export Tower."
Starting next year, HANMI Semiconductor plans to supply "TC Bonder 4" equipment to the HBM4 (6th-generation) market, where global memory companies will begin mass production. In addition, at the end of next year, it will launch a "wide TC bonder" to support production of "wide HBM." Wide HBM is next-generation HBM that expands DRAM die area to support greater memory capacity and faster data processing.