Chairman Kwak Dong-shin of HANMI Semiconductor (right) poses for a commemorative photo with Prime Minister Kim Min-seok (left) after receiving the 300 Million Dollar Export Tower at the Trade Day ceremony held at COEX on the 4th. /Courtesy of HANMI Semiconductor

HANMI Semiconductor won the "$300 million export tower" at the 62nd Trade Day ceremony held at COEX in Gangnam-gu, Seoul, on the 4th. It was recognized for its technology after exporting a large volume of semiconductor equipment to the global market, including TC bonders for high bandwidth memory (HBM).

The export tower is an award presented by the Korea International Trade Association and the Ministry of Trade, Industry and Energy to recognize the contributions of corporations that have pioneered overseas markets and increased exports. Winners are selected based on export performance during the one-year period from July 1 last year to June 30 this year.

HANMI Semiconductor won the "$100 million export tower" in 2011 and the "$200 million export tower" in 2021, and this year won the "$300 million export tower," accelerating its export growth. In particular, it proved steep growth by reaching from $200 million to $300 million in just four years.

HANMI Semiconductor is a semiconductor equipment corporations founded in 1980 and has more than 320 customers worldwide. Over the past 10 years, overseas sales have accounted for an average of about 70%, demonstrating strong competitiveness in the global market.

The key equipment driving HANMI Semiconductor's recent export growth is the TC bonder, essential for HBM production. HANMI Semiconductor currently holds the No. 1 global market share in HBM TC bonders, a core component of AI Semiconductor. Focusing on strengthening intellectual property since 2002, it has continued to expand its technological competitiveness, including filing 130 patents related to HBM equipment to date.

HANMI Semiconductor is also expected to lead the market in HBM4, which global memory makers are set to mass-produce next year, by supplying its "TC Bonder 4" equipment. TC Bonder 4 was launched in May and established a mass-production system in July.

HANMI Semiconductor has also maintained unrivaled technological competitiveness by ranking No. 1 worldwide for 21 consecutive years since 2004 in the micro saw vision placement (MSVP) market. MSVP is essential equipment in semiconductor manufacturing processes that cuts, cleans, dries, inspects, sorts, and loads semiconductor packages.

Chairman Kwak Dong-shin of HANMI Semiconductor said, "This $300 million export tower award is the result of HANMI Semiconductor's technology being recognized in the global market along with the growth of the HBM market," adding, "I would like to express my gratitude to Chairman Sanjay of Micron Technology in the United States for trusting HANMI Semiconductor." He added, "We will continue to contribute to the growth of Korea's semiconductor industry through ongoing technological innovation and strengthening our global network."

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