Samsung Electronics carried out a reorganization to move the high-bandwidth memory (HBM) development team, which it established last year, under the DRAM development office. It is analyzed that the company moved to reorganize the HBM development team as the lagging HBM business stabilized.
According to the industry on the 27th, Samsung Electronics held a briefing for executives that day to explain the direction of the reorganization. In the DS division, which is in charge of the semiconductor business, personnel from the HBM development team were moved into the design team under the DRAM development office. Son Young-su, the executive vice president who had led the HBM development team, was appointed head of the design team.
Samsung Electronics created the HBM development team through a reorganization in July last year to restore competitiveness in the HBM business. It was carried out about a month after Jun Young-hyun was appointed head of the DS division in May of the same year. At the time, Samsung Electronics lost the lead to SK hynix in the HBM market and lost face. In response, it created a dedicated HBM organization and concentrated development personnel to strengthen technological competitiveness.
Samsung Electronics determined that it had secured a considerable portion of the technology for next-generation HBM products such as sixth-generation HBM (HBM4), and through this reorganization, assigned HBM-related personnel to the design team after about a year. Samsung Electronics has recently succeeded in entering the HBM supply chains of global big tech companies such as Nvidia, AMD, OpenAI, and Broadcom, and is being evaluated as having put its HBM business on the right track.