HANMI Semiconductor said on the 19th that its high-bandwidth memory (HBM) production equipment, the "TC Bonder," was selected as a "2025 World-Class Product."
The World-Class Product program has been hosted by the Ministry of Trade, Industry and Energy and organized by the Korea Trade-Investment Promotion Agency (KOTRA) since 2001. To be selected, a product must rank within the top five in global market share and hold at least a 5% share. Exports must reach at least $5 million annually, and the product must account for 30% or more of the total export value of similar products from Korea. Even if these conditions are met, the product can only be selected as a "World-Class Product" after passing technology and quality evaluations. Companies selected can use the World-Class Product certification logo and receive support such as preferential treatment and extra points for export support services and participation in overseas exhibitions.
The TC Bonder is core equipment required to produce HBM, a key component for delivering artificial intelligence (AI) services. HANMI Semiconductor in 2017 released the world's first "TSV Dual Stacking TC Bonder." It holds all TC bonding technologies for HBM production, including the NCF (Non-Conductive Film) type and the MR-MUF (Mass Reflow-Molded Underfill) type. Since 2002, it has filed 130 patents related to HBM equipment, securing technological competitiveness. HANMI Semiconductor in particular holds about a 90% share in the mass-production 5th-generation HBM (HBM3E) market. This year, it also established a mass-production system for the "TC Bonder 4," equipment for 6th-generation HBM (HBM4). The company plans to release a "Wide TC Bonder" for next-generation HBM by the end of 2026.
This is the third time HANMI Semiconductor has been selected for the World-Class Product program. In 2005, HANMI Semiconductor's "Vision Placement" was selected as a World-Class Product, and in 2006 "Trim Form Singulation" was named a Next-Generation World-Class Product before being elevated to a World-Class Product in 2010.
A HANMI Semiconductor official said, "The selection of the TC Bonder as a World-Class Product will serve as an opportunity to further cement our position in the global HBM market," adding, "We will continue to lead the global market through innovative technology development."