As competition in sixth-generation high-bandwidth memory (HBM4) in the memory semiconductor industry heats up, demand for next-generation HBM is coming into view, prompting Samsung Electronics and SK hynix to speed up development. Starting with seventh-generation HBM (HBM4E), the next-generation HBM, the market is expected to expand from "universal" products that are developed and mass-produced to set standards to "customized" products in which core components are designed and supplied in ways desired by customers.
According to the industry on the 13th, Samsung Electronics and SK hynix have reportedly set a goal of completing HBM4E development as early as the first half of next year. HBM4E is said to be mounted in new artificial intelligence (AI) accelerators from global big tech, including the R300, the top version of Nvidia's Rubin platform. With AI accelerators featuring HBM4E slated for release in 2027, development is being accelerated to complete quality verification in the second half of next year.
As HBM4E is expected to emerge as the mainstream product in the HBM market in two years, Samsung Electronics and SK hynix have jumped into the race to seize the market. Son In-jun, a researcher at Heungkuk Securities, said, "The year-over-year growth rate of HBM demand is estimated at 77% next year and 68% in 2027," adding, "In 2027, HBM4E will account for 40% of total HBM demand."
Up to the HBM4 market, SK hynix, which has solidified a solo lead, has taken the initiative. SK hynix was the first among memory semiconductor corporations to wrap up negotiations with Nvidia, a major player in the industry, on next year's HBM4 supply volume. SK hynix is reportedly set to supply a significant portion of the initial HBM4 volumes to be mounted on Nvidia's Rubin platform. Nvidia has said that Samsung Electronics has entered the HBM4 supply chain, but supply negotiations are said to still be underway.
However, with expectations that the customized HBM market will fully blossom starting with HBM4E, some analysis suggests the market landscape could be reshaped. Both Samsung Electronics and SK hynix are preparing for a customized HBM market in which the "logic die (base die)"—the brain of HBM4E—is designed and manufactured in ways desired by customers. To respond to this market in a timely manner, it is important to have design capabilities to build products in the form customers want and to possess foundry (contract chip manufacturing) process capabilities. Having internalized all these capabilities, Samsung Electronics has been building experience by applying its own foundry process to the logic die starting with HBM4.
A semiconductor industry official said, "It is true that the prevailing view is that SK hynix, whose partnership with Nvidia is strong, will maintain its leading position through the HBM4E market," but added, "However, as HBM4E sees diversified demand for customized products from global big tech corporations developing their own AI accelerators, Samsung Electronics, which has foundry process capabilities and production capacity that allow for quick response, also has advantages, raising the possibility of market reshuffling."
Micron has also said it is working with TSMC with an eye on the HBM4E market. Unlike SK hynix, which applied TSMC's foundry process to manufacture the logic die starting with HBM4, Micron applied its own advanced DRAM process. However, as the need for advanced foundry processes to meet customer demand and improve product performance has grown, Micron is analyzed to have pursued collaboration with TSMC.